Laser process All Types of thin materials, precision materials 

Laser cutting, Laser Dicing, Laser scribing, Laser drilling, Laser engraving 

Ultrafast laser processing   

The goal of micromachining is the creation of micron-scale features, such as holes, grooves and marks, with high-dimensional accuracy while avoiding peripheral thermal damage to surrounding material. In other words, precise, clean cuts and marks with high surface quality and minimal heat-affected zone (HAZ). 

Picosecond Laser processing application :

Sapphire substrates and wafers

Ceramic substrates, Piezo Ceramics and hybrid circuits

Capacitors - chips

Quartz, Fused Silica, Thin Glass, substrates wafers and plates

Semiconductor microelectronic materials 

Compound semiconductor materials

Thin metals and small diameter rods

Ferrites

FPC circuit board cutting&scribing

Bonded wafers and MEMS wafers and substrates

Dicing MEMS wafers

Custom dicing 

Precision optical dicing

Thin dice by thinning after dicing

Wafer dicing, cutting, sawing, scribing

And all types of special materials

Sapphire Cutting, Polymer Film Cutting, 

Silicon wafer Cutting, wafer dicing, wafer scribing

Ceramic substrates Cutting&scribing, 

Diamond Lens Cutting&dicing 

Laser micromachining features:

The laser beam allows for controlled fusing of materials

The picosecond laser cutting is cold cutting, no damage on materials

The laser produces clean and sealed cut edges

The laser can cut even the smallest radii precisely

The laser can cut simple geometries at record speed

The laser is contact free, no pressure is exerted on the material

The laser consistently produces perfect results 

The laser will not result in chipping of paint from the end product

The benefits of a laser cutting machine: Faster than a cutting plotter, more precise than punching dies, no damage on thin films, and more economical